Conventional Structures

1. 1: Conductor: Copper
2. 2: Semi-conductive layer
3. 3: Insulation Layer
4. 4: Semi-conductive layer
5. 5: Copper Tape
6. 6: Bedding: HFFR compound Evatane®
7. 7: Armour: Tinned copper wire braid
8. 8: Outer sheat: HFFR Compounds Evatane® or Lotader®

 Instant Noodle Packaging Laminate:

BOPP / Print*  / PP

 --> 

 *Print: Chlorinated PP inks containing EVA 42-60

 Potato Chip Packaging Laminate:

BOPP / Print* / Primer / Tie Layer* / mPET / Seal Layer

 --> 

 *Tie Layer: LDPE + Lotader® 3210